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| hardtechgroup.com/hgcb |
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HGCB copper clad phenolic paper laminate from Hardtech Industries Ltd. is made of cellulose paper
impregnated with phenolic resins and adhesive coated foil under heating and pressing. This product is
used as substrate of various printed circuit boards. The product has been UL approved.
Outward Appearance
The laminate has perfectly shaped edges. The laminates are perfectly joint together and there are no
cracks. The area coated in copper is free of bubbles, wrinkles, pinholes, deep scratches, resin stains,
strange particles or any other defect which could affect its use.
If the area coated with copper had faded or had some stain of dirt and it was necessary to clean it, it can be washed and rinsed with a solution of hydrochloride acid with a density of 1.02gr/m3 or any other organic solvent as adequate.
The surface with no copper coating is free of bubbles, jags, resin stains, strange particles or any other defect.
Specifications
| Nominal area (LxA) | Tolerance |
-0 |
|
-0 |
Nominal Thickness
| Nominal Thickness (mm) | ||||||
| Individual Tolerance (mm) | |
Note: other thickness available. Please check with us.
Rectangularity
| Size (mm) | ||
| Rectangularity (mm) |
Deformation
| Nominal thickness (mm) | ||
| Bow Value (d) | ||
| Torsion Value (d') |
The Bow Value ?d" and Torsion ?d" is not in any case bigger than the specificationvalues of the table, when the length of the copper clad laminate is converted into L=1000m.
Main characteristics
| Item | Unit | Specific Rate |
| Peel Strength in normal condition | ||
| Insulation resistance after immersed in boiling water | ||
| Dip Soldering Resistance 260 +5 +0 ºC/10 S | -- |